King-Ning Tu - Electronic Packaging Science and Technology

The following chapters will be divided into three parts. In Part I, we cover briefly the history of bonding technology in Chapter 2, starting from wire‐bonding, tab‐automated bonding (TAB), flip chip C‐4 solder joint bonding, micro‐bump bonding, Cu‐to‐Cu direct bonding, and hybrid bonding. In Chapter 3, we shall cover the structure, properties, and applications of randomly oriented and (111) unidirectionally oriented nano‐twin Cu. Then, Chapters 4and 5will be dedicated to chemical reactions and kinetic processes in solder joint formation. Chapter 4will review solid–liquid interfacial diffusion (SLID) reactions between liquid solder and Cu. Chapter 5will review solid–solid reactions between solid solder and Cu upon annealing. The kinetics of growth of IMC, which is a stoichiometric compound without composition gradient, has been an outstanding problem in the kinetic analysis of layered interfacial reactions. We introduce Wagner’s diffusivity to overcome it.

Part II consists of three chapters related to electric circuitry in electronic packaging. The emphasis is about the design of low‐power devices and high intelligent integration. The technical issues of the need of faster rate and larger amount of data transport are discussed. How to increase the I/O density and the bandwidth in packaging technology are explained.

Part III is a collection of chapters on reliability science. It begins with a chapter on irreversible processes of atomic flow, heat flow, and charge flow in interconnects. The topics of electromigration, thermomigration, stress migration, and failure analysis will be covered. The topic of men‐time‐to‐failure (MTTF) will be reviewed on the basis of entropy production.

In the last chapter, Chapter 14, a discussion on how to use AI to accelerate the solving of reliability problems will be explored. We propose an X‐ray‐based graphic processing unit (X‐GPU) to analyze reliability failure distribution in any newly developed 3D IC device for mass production. The goal is to change the time‐dependent and time‐consuming reliability tests to time‐independent tests.

1 1 Chen, K.‐N. and Tu, K.N. (2015). Materials challenges in three‐dimensional integrated circuits. MRS Bulletin 40: 219–222.

2 2 Iyer, S. (2015). Three‐dimensional integration: an industry perspective. MRS Bulletin 40: 225–232.

3 3 Chen, C., Yu, D., and Chen, K.‐N. (2015). Vertical interconnects of microbumps in 3D integration. MRS Bulletin 40: 257–263.

4 4 Prigogine, I. (1967). Introduction to Thermodynamics of Irreversible Processes, 3e. New York: Wiley‐Interscience.

5 5 Tu, K.N. (2011). Chapter 10 on “Irreversible processes in interconnect and packaging technology”. In: Electronic Thin‐Film Reliability (ed. K.N. Tu). Cambridge, UK: Cambridge University Press.

6 6 Tu, K.N., Liu, Y., and Li, M. (2017). Effect of Joule heating and current crowding on electromigration in mobile technology. Applied Physics Reviews 4: 011101.

7 7 Tu, K.N. and Gusak, A.M. (2019). A unified model of mean‐time‐to‐failure for electromigration, thermomigration, and stress‐migration based on entropy production. Journal of Applied Physics 126: 075109.

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