Jiyan Dai - Ferroic Materials for Smart Systems

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Ferroic Materials for Smart Systems: краткое содержание, описание и аннотация

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Presents state-of-the-art knowledge?from basic insights to applications?on ferroic materials-based devices <br> <br> This book covers the fundamental physics, fabrication methods, and applications of ferroic materials and covers bulk, thin films, and nanomaterials. It provides a thorough overview of smart materials and systems involving the interplays among the mechanical strain, electrical polarization, magnetization, as well as heat and light. Materials presented include ferroelectric, multiferroic, piezoelectric, electrostrictive, magnetostrictive, and shape memory materials as well as their composites. The book also introduces various sensor and transducer applications, such as ultrasonic transducers, surface acoustic wave devices, microwave devices, magneto-electric devices, infrared detectors and memories. <br> <br> Ferroic Materials for Smart Systems: Fabrication, Devices and Applications introduces advanced measurement and testing techniques in ferroelectrics, including FeRAM and ferroelectric tunnelling based resistive switching. It also looks at ferroelectricity in emerging materials, such as 2D materials and high-k gate dielectric material HfO2. Engineering considerations for device design and fabrication are examined, as well as applications for magnetostrictive devices. Multiferroics of materials possessing both ferromagnetic and ferroelectric orders is covered, along with ferroelastic materials represented by shape memory alloy and magnetic shape memory alloys. <br> <br> -Brings together physics, fabrication, and applications of ferroic materials in a coherent manner <br> -Discusses recent advances in ferroic materials technology and applications <br> -Covers dielectric, ferroelectric, pyroelectric and piezoelectric materials <br> -Introduces electrostrictive materials and magnetostrictive materials <br> -Examines shape memory alloys and magneto-shape-memory alloys <br> -Introduces devices based on the integration of ferroelectric and ferromagnetic materials such as multiferroic memory device and ME coupling device for sensor applications <br> <br> Ferroic Materials for Smart Systems: Fabrication, Devices and Applications will appeal to a wide variety of researchers and developers in physics, materials science and engineering. <br>

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The SMAs have been widely used in devices from brace of orthodontia and other medical applications, air jet, satellite antenna, etc. Research was carried out in developing systems that would optimize the chevron “immersion” into the jet flow based on the flight condition. As shown in Figure 1.14a, SMAs activated by heat were developed that would allow for full chevron immersion in jet flow during high thrust requirements (e.g. during take‐off) and not immersing it during cruise where the thrust efficiency is of greater importance (Anon n.d.).

Figure 114a Brace of orthodontia using shape memory alloys and b - фото 16

Figure 1.14(a) Brace of orthodontia using shape memory alloys and (b) arthrodesis device developed by Karnes et al.

For broken bone rehabilitation, a SMA plate with a memory transfer temperature close to body temperature can be attached to both ends of the broken bone as shown in Figure 1.14b. From body heat, the plate will contract and retain its original shape, therefore exerting a compression force on the broken bone at the place of fracture. After the bone has healed, the plate continues exerting the compressive force and aids in strengthening during rehabilitation (Garlock et al. 2017).

1.5 Scope of This Book

In Chapters 2– 5, fundamentals of ferroelectrics, applications of ferroelectric materials, recent advances, and advanced measurement and testing techniques in ferroelectrics will be introduced. In particular, device applications of ferroelectric materials in thin film form will be introduced including FeRAM, ferroelectric tunneling‐based resistive switching, etc. The recent advances include ferroelectricity in emerging materials such as 2D materials and high‐ k gate dielectric material HfO 2, while the advanced characterization technologies include the piezoresponse force microscopy (by imaging and switching ferroelectric domains) and Cs‐corrected transmission electron microscopy (TEM) where atomic level ionic displacement can be identified.

As the most important property application of ferroelectric materials, fundamentals of piezoelectric physics and engineering considerations for device design and fabrication are introduced in Chapters 6and 7.

In Chapter 8, starting with a brief introduction on origin of ferromagnetism and its analogy to ferroelectrics, device applications, particularly for magnetostrictive devices, are introduced.

Chapters 9and 10will introduce the multiferroics of materials possessing both ferromagnetic and ferroelectric orders including single phase and composite materials. In particular, devices based on the integration of ferroelectric and ferromagnetic materials such as multiferroic memory device and ME coupling device for sensor applications will be introduced.

In Chapter 11, ferroelastic materials represented by SMA and magnetic SMAs as well as their device applications will be introduced.

References

1 Boyn, S., Grollier, J., Lecerf, G. et al. (2017). Learning through ferroelectric domain dynamics in solid‐state synapses. Nature Communications 8: 1–7.

2 Chang, C.‐Y. and Chen, T.‐L. (2017). Design, fabrication, and modeling of a novel dual‐axis control input PZT gyroscope. Sensors 17 (11): 2505.

3 Cho, J. (2018). Amid contradictory forecast: IC insights: ‘Memory chips will grow at annual rate of 5% only on average by 2022’. Seoul, Korea: BusinessKorea.

4 Garlock, A., Karnes, W.M., Fonte, M. et al. (2017). Arthrodesis devices for generating and applying compression within joints. US 2017/0296241 A1, Available at: https://patents.google.com/patent/US20170296241A1/en.

5 Li, M., Dong, C., Zhou, H. et al. (2017). Highly sensitive DC magnetic field sensor based on nonlinear ME effect. IEEE Sensors Letters 1 (6): 1–4.

6 Renesas Electronics Corporation (2017). Renesas electronics achieves large‐scale memory operation in fin‐shaped MONOS flash memory for industry's first high‐performance, highly reliable MCUs in 16/14nm process nodes and beyond.

7 Wang, Y., Gray, D., Berry, D. et al. (2011). An extremely low equivalent magnetic noise magnetoelectric sensor. Advanced Materials 23 (35): 4111–4114. Available at: https://doi.org/10.1002/adma.201100773.

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