Doruk Senkal - Whole-Angle MEMS Gyroscopes

8 Chapter 8Figure 8.1 Electrodes are fabricated separately on an SOI stack, bonded to t...Figure 8.2 SEM image of an adjustable electrode with 400 μm maximum displace...Figure 8.3 Ratchet mechanism acting on the electrode structure, the electrod...Figure 8.4 Released wineglass structure with 4.2 mm diameter, 50 μm thicknes...Figure 8.5 Electrode structures assembled onto a micro‐glassblown wineglass ...Figure 8.6 Electrostatic frequency sweep using adjustable electrode assembly...Figure 8.7 A glassblown spherical resonator with assembled electrodes. Diame...Figure 8.8 Process flow for fabrication of micro‐glassblown wineglass resona...Figure 8.9 SEM image of a stand‐alone micro‐wineglass structure after releas...Figure 8.10 Metallized micro‐wineglass structure with integrated electrodes....Figure 8.11 Packaged and wirebonded micro‐wineglass resonator. Diameter 4.4 ...Figure 8.12 Laser Doppler Vibrometer was used to scan along the perimeter of...Figure 8.13 Measured velocity amplitude distribution (mm/s) identifying (a) Figure 8.14 Experimental frequency sweeps of and wineglass modes, showin...Figure 8.15 Frequency split versus DC bias, showing that the frequency split...Figure 8.16 Frequency sweeps of mode of four additional wineglass resonato...Figure 8.17 Micro‐glassblowing process can create arrays of inverted‐winegla...Figure 8.18 Out‐of‐plane electrode architecture consists of a micro‐glassblo...Figure 8.19 Out‐of‐plane transduction scheme utilizes out‐of‐plane component...Figure 8.20 Electrode configuration: four electrodes are designated as force...Figure 8.21 Out‐of‐plane to in‐plane displacement ratio for mushroom‐shaped ...Figure 8.22 A packaged one million ‐factor fused silica wineglass structure...Figure 8.23 Wafer‐level fabrication process for fused silica micro‐wineglass...Figure 8.24 Uniform 10 μm capacitive gaps have been demonstrated on 7 mm she...Figure 8.25 Frequency sweep revealed a ‐factor of 1.14 million and as fabri...Figure 8.26 Ring‐down experiment at shows , giving 1.05 million ‐factor ...Figure 8.27 ‐factor versus pressure level experiment. ‐factors above 1 mil...

9 Chapter 9Figure 9.1 Fabrication process consists of (a) bonding of pre‐etched cap and...

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2 Table of Contents

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IEEE Press445 Hoes Lane Piscataway, NJ 08854

IEEE Press Editorial BoardEkram Hossain, Editor in Chief

Doruk Senkal

Andrei M. Shkel

Copyright © 2020 by The Institute of Electrical and Electronics Engineers, Inc. All rights reserved.

Published by John Wiley & Sons, Inc., Hoboken, New Jersey.

Published simultaneously in Canada.

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